 Punte per non contatto/semicontatto della serie NSG03 con rivestimento conduttivo di TiN, frequenza di risonanza 90-116kHz, costante di forza 0,5-2,2N/m.
NSG03/TiN/15
| High Resolution NONCONTACT "GOLDEN" Silicon Cantilevers NSG03 series with TiN conductive coating |
- Standard chip size: 1.6x3.6x0.4 mm.
- High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Tip side of the chip is coated by TiN conductive coating.
- Thickness of TiN film is 20-30nm.
- Typical curvature radius of a tip: 35 nm.
- Tip height: 10 - 15 µm.
- Each chip has one RECTANGULAR spring.
- Recommended for noncontact/semicontact modes.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for probes of NSG03 series |
| Chip thickness |
0.4mm |
| Reflective side |
Au |
| Spring number |
1 |
| Aspect ratio |
3:1 |
| Cone angle j |
<=22° |
| Curvature radius of a tip |
typical 10nm |
|
 |
|
Cantilever series
|
Spring
|
Cantilever lenght, L±5µm
|
Cantilever width, W±3µm
|
Cantilever thickness, µm
|
Resonant frequency, kHz
|
Force constant, N/m
|
|
min
|
typical
|
max
|
min
|
typical
|
max
|
min
|
typical
|
max
|
|
NSG03
|
A
|
130
|
35
|
1.0
|
1.2
|
1.4
|
70
|
90
|
116
|
0.5
|
1.1
|
2,2
|
 |
Recommended measuring mode
N - noncontact, semicontact
C - contact |
cantilever series |
S - with calibrated SEM photo for each tip and guaranteed curvature |
Copyright © 2003, Nano Technology Instruments - Europe BV.
Copyright © 1998-2003, NT-MDT. All rights reserved.
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