 Punte per non-contatto della serie NSG01 con rivestimento conduttivo di Au, frequenza di risonanza 115-190kHz, costante di forza 2,5-10N/m.
NSG01/Au
| High Resolution NONCONTACT "GOLDEN" Silicon Cantilevers NSG01 series with Au conductive coating |
- Standard chip size: 1.6x3.6x0.4 mm.
- High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Tip side of the chip is coated by Au conductive coating.
- Thickness of Au film is 20-30nm.
- Typical curvature radius of a tip: 35 nm.
- Tip height: 10 - 15 µm.
- Each chip has one RECTANGULAR spring.
- Recommended for noncontact/semicontact modes.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for probes of NSG01 series |
| Chip thickness |
0.4mm |
| Reflective side |
Au |
| Spring number |
1 |
| Aspect ratio |
3:1 |
| Cone angle j |
<=22° |
| Curvature radius of a tip |
typical 10nm |
|
 |
|
Cantilever series
|
Spring
|
Cantilever lenght, L±5µm
|
Cantilever width, W±3µm
|
Cantilever thickness, µm
|
Resonant frequency, kHz
|
Force constant, N/m
|
|
min
|
typical
|
max
|
min
|
typical
|
max
|
min
|
typical
|
max
|
|
NSG01
NSG01S
|
A
|
130
|
35
|
1.7
|
2.0
|
2.3
|
115
|
150
|
190
|
2.5
|
5.5
|
10
|
- Calibrated SEM photo for each
cantilever tip and guaranteed curvature radius 10nm or less at
customer's requirement ( cantilever series with letter "S" in the
series name).
- Compatible with the most commercial SPM devices.
- Chemically stable Au coating.
- Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
 |
Recommended measuring mode
N - noncontact, semicontact
C - contact |
cantilever series |
S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less. |
Copyright © 2003, Nano Technology Instruments - Europe BV.
Copyright © 1998-2003, NT-MDT. All rights reserved.
|
