 Punte per non contatto conduttive ricoperte di diamante della serie DCP11; ogni chip ha 2 cantilever, frequenza di risonanza 190-325kHz, 115-190kHz; costante di forza 5,5-22,5N/m, 2,5-10N/m. Punte stabili, non-dintruttive, resistenti all'usura con un rivestimento conduttivo di diamante che vi permette di usarle molto a lungo.
DCP11
Coating Specification:
- Thickness of diamond coating is about 70nm.
- Diamond coating is doped with nitrogen.
- Film resistivity: 0,5-1 Ohm*cm
- Tip curvature radius after coating is 50-70nm.
- Recommended for electrical modes (such as EFM, SCM, SKM, LAO Lithography, SRM)
Probe specification
- Standard chip size: 1.6x3.6x0.4 mm.
- High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Typical curvature radius of a tip: 10 nm.
- Tip height: 10 - 15 µm.
- Each chip has two RECTANGULAR springs.
- Compatible with the most commercial SPM devices.
- Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for DCP11 series |
| Chip thickness |
0.4mm |
| Reflective side |
Au |
| Spring number |
2 |
| Aspect ratio |
3:1 |
| Cone angle f |
<=22° |
| Curvature radius of a tip |
typical 10nm |
|
    |
|
Available
Cantilever series
|
Spring
|
Cantilever lenght, L±5µm
|
Cantilever width, W±3µm
|
Cantilever thickness, µm
|
Resonant frequency, kHz
|
Force constant, N/m
|
|
min
|
typical
|
max
|
min
|
typical
|
max
|
min
|
typical
|
max
|
|
DCP11
|
A
|
100
|
35
|
1.7
|
2.0
|
2.3
|
190
|
255
|
325
|
5.5
|
11.5
|
22.5
|
|
B
|
130
|
35
|
1.7
|
2.0
|
2.3
|
115
|
150
|
190
|
2.5
|
5.5
|
10
|
Copyright© 2003, Nano Technology Instruments - Europe BV.
Copyright© 1998-2003, NT-MDT. All rights reserved.
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