 Punte per contatto della serie CSG01, frequenza di risonanza 7-14kHz, costante di forza 0,01-0,08N/m.

CSG01/50
| High Resolution CONTACT "GOLDEN" Silicon Cantilevers CSG01 series |
- Standard chip size: 1.6x3.6x0.4 mm.
- High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Typical curvature radius of a tip: 10 nm.
- Tip height: 10 - 15 µm.
- Each chip has one RECTANGULAR spring.
- Recommended for contact mode.
- Can be supplied with conductive TiN, W2C, Pt, Au coatings.
- Calibrated SEM photo for each cantilever tip with guaranteed curvature radius 10nm or less.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for probes of CSG01 series |
| Chip thickness |
0.4mm |
| Reflective side |
Au |
| Spring number |
1 |
| Aspect ratio |
3:1 |
| Cone angle j |
<=22° |
| Curvature radius of a tip |
typical 10nm |
|
 |
|
Cantilever series
|
Spring
|
Cantilever lenght, L±5µm
|
Cantilever width, W±3µm
|
Cantilever thickness, µm
|
Resonant frequency, kHz
|
Force constant, N/m
|
|
min
|
typical
|
max
|
min
|
typical
|
max
|
min
|
typical
|
max
|
|
CSG01
CSG01S
|
B
|
350
|
35
|
0.7
|
1.0
|
1.3
|
7
|
10
|
14
|
0.01
|
0.03
|
0.08
|
- Calibrated SEM photo for each cantilever tip and guaranteed curvature radius 10nm or less at customer's requirement ( cantilever series with letter "S" in the series name).
- Compatible with the most commercial SPM devices.
- Chemically stable Au coating.
- Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
 |
Recommended measuring mode
N - noncontact, semicontact
C - contact |
cantilever series |
S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less. |
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