Punte conduttive per non contatto ricoperte di diamante della serie DCP01. Ogni chip ha un cantilever, frequenza di risonanza 115-190kHz, costante di forza 2,5-10N/m.
Coating Specification:
- Thickness of diamond coating is about 100 nm.
- Diamond coating is doped with nitrogen.
- Film resistivity: 0,5-1 Ohm*cm
- Tip curvature radius after coating is about 100 nm.
- Recommended for electrical modes (such as EFM, SCM, SKM, LAO Lithography, SRM)
Probe specification
- Standard chip size: 1.6x3.6x0.4 mm.
- High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
- Typical curvature radius of a tip: about 100 nm.
- Tip height: 10 - 15 µm.
- Each chip has one RECTANGULAR spring.
- Compatible with the most commercial SPM devices.
- Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
- Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
| Specification for DCP01 series |
|
|
Cantilever series |
Cantilever length, L±5µm |
Cantilever width, W±3µm |
Cantilever thickness, µm |
Resonant frequency, kHz |
Force constant, N/m |
||||||
|
min |
typical |
max |
min |
typical |
max |
min |
typical |
max |
|||
|
DCP01 |
130 |
35 |
1.7 |
2.0 |
2.3 |
115 |
150 |
190 |
2.5 |
5.5 |
10 |