Punte conduttive per non contatto ricoperte di diamante della serie DCP01. Ogni chip ha un cantilever, frequenza di risonanza 115-190kHz, costante di forza 2,5-10N/m.

 

Coating Specification:

  • Thickness of diamond coating is about 100 nm.
  • Diamond coating is doped with nitrogen.
  • Film resistivity: 0,5-1 Ohm*cm
  • Tip curvature radius after coating is about 100 nm.
  • Recommended for electrical modes (such as EFM, SCM, SKM, LAO Lithography, SRM)

Probe specification

  • Standard chip size: 1.6x3.6x0.4 mm.
  • High cemically stable reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
  • Typical curvature radius of a tip: about 100 nm.
  • Tip height: 10 - 15 µm.
  • Each chip has one RECTANGULAR spring.
  • Compatible with the most commercial SPM devices.
  • Silicon is doped by boron with the concentration about 5x1020 cm-3 to avoid electrostatic charges.
  • Packaged in GelPak® boxes.
GelPak® is a registered trade mark of Vichem Corporation.
 
Specification for DCP01 series
Chip thickness 0.4mm
Reflective side Au
Spring number 1 rectangular
Aspect ratio 3:1
Cone angle f <=22°
Curvature radius of a tip typical 100 nm
   

 

Cantilever series

Cantilever length, L±5µm

Cantilever width, W±3µm

Cantilever thickness, µm

Resonant frequency, kHz

Force constant, N/m

min

typical

max

min

typical

max

min

typical

max

DCP01

130

35

1.7

2.0

2.3

115

150

190

2.5

5.5

10