Features:
- Mounting flange: 2.75" (NW35CF)
- In vacuum length: 200 mm
- In vacuum diameter: 34 mm max.
- Bakeout temperature: 200° C
- Beam Divergence: ∼15° half angle
- Gas Flow: 10-5 - 1 sccm
- Operating Pressure: < 10-10 - 10-5 mbar
- Hydrogen Flux: 5 x 1013 atoms/cm2 at 10 cm distance
- Cracking efficiency: Approaching 100 %
- E-beam Power: 0 - 60 W
Applications:
- Damage free in-situ cleaning e.g. of GaAs, InP, Ge and Si.
- Removal of residual oxygen and carbon by reduction to volatile hydrides
- Low temperature cleaning
- Surfactant - promoting 2-D growth
- Post growth surface treatment/improvement
- Chemical passivation and surface reconstruction
- Annealing of amorphous silicon
Product Information:
The SPECS TGC-H is a fully UHV compatible thermal gas cracker source
using electron bombardment heating of a tungsten capillary to thermally
dissociate the gas passing through it. The cracking efficiency is
determined by the equilibrium thermodynamics of the dissociation of
hydrogen molecules into atoms. For capillary temperatures of
1400° C or more and pressuresbelow 10-8
mbar this is nearly 100%. The small size and thermal mass of the
capillary means that very little power is required with negligible heat
load into the system. The filament itself is easy to exchange.
Moreover, no differential pumping is needed for operation in UHV and
due to the electrically grounded capillary zero ion emission is
achieved.
