Pra.Ma.

Today electronic devices govern our everyday life. There is the need for continuous miniaturization in production and integration of micro- and nanoelectronics, still fulfilling Moore's law. Also the production of low cost large scale devices, like photovoltaic modules with typical areas of one square meter per module, is a challenge for future worldwide progression. In both fields the physical properties are determined by materials interfaces. For large modules minimization of materials consumption as well as electrical losses consequently leads to the development of thin film devices, in most cases produced by using non-epitaxial deposition methods.

Thin-film deposition covers any technique for depositing a thin film material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive deposition or co-deposition. Often functionalization or tayloring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.

Using synergies within the Network Of Competence SPECS stands for experienced consultation and design of complete, customized thin film preparation or deposition solutions for all chemical and physical deposition applications. Integration with state-of-the-art surface analysis techniques can easily be realized. SPECS offers robust, highly reliable and precise single components for thin film deposition and surface modification: