Evaporation Guide Print E-mail
This evaporation guide represents a survey of commonly used elements and their physical properties determining their evaporation behaviour. Although in the preparation of this guide every effort has been made to ensure accuracy, completeness and clarity, it can't be guaranteed that no errors have occurred. Therefore use this information at your own risk, as a general guide. In any case use an independent check for important data.

Some materials and their compounds are extremely toxic and must be handled with great care. Manufacturers safety and handling instructions must be strictly followed!

The table which is listed below describes different materials (mainly element species), recommended effusion cell types, crucible material to be used, melting point (MP) and dedicated vapor pressure data within the UHV and HV regime.

 

Material
Symbol
Recommended source type
Crucible
material
Melting Point (°C) Temperature (°C) for vapor pressure (Torr)
10-8
10-6
10-4
Aluminium
Al
Cold Lip Effusion Cell
PBN
660
685
812
972
Antimony
Sb
Valved Cracker, Cracker or Low Temp Effusion Cell
PBN
631
279
345
425
Argon Ar
ECR Plasma Source
Alumina
...
...
...
...
Arsenic
As Valved Cracker, Cracker, Valved or Low Temp Effusion Cell
PBN
817
104
150
210
Barium
Ba
Low Temp Effusion Cell
Ta, Mo
727
272
354
462
Beryllium Be
High Temp Effusion Cell BeO, VC 1287 707 832 997
BioMaterials
...
Near Ambient Effusion Cell
Quartz, PBN, Ta, PGR
...
...
...
...
Bismuth
Bi
Low Temp Effusion Cell Al2O3, BeO, VC
271 329
409
517
Boron
B
High Temp Effusion Cell C, VC
2075
1282
1467
1707
Cadmium
Cd
Low Temp Effusion Cell Al2O3, Quartz, PBN
321
74
119
177
Calcium
Ca
Low Temp Effusion Cell Al2O3, Quartz, PBN
842
282
357
459
Carbon
C Carbon Effusion Cell
PGR
3550
1657
1867
2136
Cerium
Ce High Temp Effusion Cell Al2O3, BeO, VC
795 970
1150
1380
Cesium
Cs Near Ambient or Low Temp Effusion Cell Quartz, PBN
29
-16
22
80
Chlorine
Cl
ECR Plasma Source Al2O3
...
...
...
...
Chromium
Cr High Temp Effusion Cell VC
1907
837
977
1157
Cobalt
Co High Temp Effusion Cell Al2O3, BeO
1495
922
1067
1257
Copper
Cu
Single Filament or High Temp Effusion Cell Al2O3, Mo, Ta, BeO
1085
722
852
1027
Dysprosium
Dy
High Temp Effusion Cell Ta
1412
625
750
900
Erbium
Er
Dual Filament or Single Filament effusion cell PBN, Ta, W
1529 649
777
897
Europium
Eu
Low Temp or Dual Filament effusion cell Al2O3, Mo, Ta, PBN
822
283
361
466
Gallium
Ga
Dual Filament or Single Filament effusion cell PBN, Al2O3, BeO, Quartz
30
619
742
907
Germanium
Ge
Dual Filament or Single Filament effusion cell PBN, Al2O3, Quartz
938
812
947
1137
Gold Au
Single Filament or High Temp Effusion Cell Al2O3, PBN, VC,
1064
807
947
1132
Hydrogen
H Thermal Gas Cracker/ECR Plasma Source or RF Plasma Source
...
...
...
...
...
Indium
In
Dual Filament effusion cell Al2O3, PBN
157
488
597
742
Iridium
Ir
E-Beam Evaporator
...
2410
1850
2080
2380
Iron
Fe
E-Beam Evaporator or High Temp Effusion Cell Al2O3, BeO
1538
858
998
1180
Lanthanum
La
High Temp Effusion Cell Al2O3
920
990
1212
1388
Lithium
Li
Low Temp Effusion Cell Al2O3, BeO, PBN
180
235
306
404
Lutetium
Lu
High Temp Effusion Cell Al2O3
1663
870
1228
1376
Magnesium
Mg
Low Temp Effusion Cell Al2O3, VC, PBN
650
185
246
327
Manganese
Mn
Single Filament effusion cell Al2O3, BeO
1246
505
611
747
Mercury
Hg
Near Ambient Effusion Cell Al2O3, Quartz, PBN
-39
72
-44
7
Methane
CH4
ECR Plasma Source ...
...
...
...
...
Molybdenum Mo E-Beam Evaporator ... 2610 1592 1822 2117
Nickel
Ni
High Temp Effusion Cell Al2O3, BeO,VC
1455
927
1072
1262
Niobium
Nb
E-Beam Evaporator ...
2468
927
1072
1262
Nitrogen
N
RF Plasma Source
PBN
...
...
...
...
Organics
...
Near Ambient Effusion Cell Al2O3, Quartz, PBN
...
...
...
...
Oxygen
O
ECR Plasma Source Alumina ...
...
...
...
Palladium
Pd
High Temp Effusion Cell Al2O3, BeO
1555
842
992
1192
Phosphorus
P Valved Cracker or Valved effusion cell Al2O3, PbN, Ta/Mo
44
54 88 192
Platinum
Pt E-Beam Evaporator or High Temp Effusion Cell ThO2, C
1768
1292
1492
1747
Polymers
...
Near Ambient Effusion Cell Al2O3
...
...
...
...
Potassium
K Low Temp Effusion Cell Al2O3, Quartz, PBN
64
21 65 123
Rhenium
Re E-Beam Evaporator ... 3180
1928
2207
2570
Rhodium
Rh E-Beam Evaporator ...
1966
1277
1472
1707
Ruthenium
Ru E-Beam Evaporator ...
2310
1780
1990
2260
Scandium
Sc Dual Filament or High Temp Effusion Cell Al2O3, BeO
1541
772 917
1107
Selenium
Se
Valved Cracker, Cracker or Low Temp Effusion Cell PBN 221
63 107 164
Silicon
Si E-Beam Evaporator ...
1414
992 1147 1337
Silver Ag

Single Filament or High Temp Effusion Cell

Al2O3, Mo
962
574 685
832
Sodium
Na Low Temp Effusion Cell Quartz, PBN
98 74 123 193
Strontium
Sr Low Temp Effusion Cell VC, Mo
777 241 309 404
Sulfur
S Valved Cracker, Cracker, Valved Effusion Cell PBN
115 -10
17 55
Tantalum
Ta E-Beam Evaporator ...
2996 1960
2240 2590
Tellurium
Te Valved Cracker Effusion Cell PBN 450
155 209 280
Thallium
Tl Low Temp Effusion Cell Al2O3, Quartz
304 280 360 470
Thorium
Th E-Beam Evaporator W, Ta, Mo
1845
1430 1660
1925
Tin
Sn Dual Filament or Single Filament effusion cell PBN 232
682 807 997
Titanium
Ti E-Beam Evaporator ...
1660 1067 1235 1453
Tungsten
W E-Beam Evaporator ... 3410
2117 2407 2757
Vanadium
V High Temp Effusion Cell or E-Beam Evaporator W, Mo 1910
1162 1332 1547
Ytterbium
Yb Low Temp Effusion Cell Ta 824 247 317 417
Yttrium
Y High Temp Effusion Cell Al2O3
1526 957
1117 1332
Zinc
Zn Low Temp Effusion Cell Al2O3, Quartz, PBN
420
123 177 247
Zirconium
Zr E-Beam Evaporator ... 1852
1477 1702 1987

This guide was prepared by Edward Graper of Lebow Corporation and is being made available to assist SPECS GmbH customers. Neither Edward Graper nor Lebow Corporation warranties the accuracy of this information or the results of its applications. This guide may not be reproduced in any way without written permission from Lebow Corporation, which will generally be granted.

Some materials and their compounds are extremely toxic and must be handled with great care. Manufacturers safety and handling instructions must be strictly followed!

Neither Lebow Corporation nor SPECS GMBH accept responsibility for any misuse of materials or their evaporation and deposition applications.

 
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