NSG03/TiN Print E-mail
nsgtin.jpgNoncontact/semicontact modes NSG03 series with TiN conductive coating, resonant frequency 90-116kHz, force constant 0,5-2,2N/m.


nsgtina.jpg
NSG03/TiN/15

High Resolution NONCONTACT "GOLDEN" Silicon Cantilevers NSG03 series with TiN conductive coating
  • Standard chip size: 1.6x3.6x0.4 mm.
  • High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
  • Tip side of the chip is coated by TiN conductive coating.
  • Thickness of TiN film is 20-30nm.
  • Typical curvature radius of a tip: 35 nm.
  • Tip height: 10 - 15 µm.
  • Each chip has one RECTANGULAR spring.
  • Recommended for noncontact/semicontact modes.
  • Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

 

Specification for probes of NSG03 series

 

 

Chip thickness 0.4mm
Reflective side Au
Spring number 1
Aspect ratio 3:1
Cone angle j <=22°
Curvature radius of a tip typical 10nm
   nsgtinb.jpg

 

 

Cantilever series

Spring

Cantilever lenght, L±5µm

Cantilever width, W±3µm

Cantilever thickness, µm

Resonant frequency, kHz

Force constant, N/m

min

typical

max

min

typical

max

min

typical

max

NSG03

A

130

35

1.0

1.2

1.4

70

90

116

0.5

1.1

2,2

 

 

Cantilever series

 

 

csg01e.jpg
Recommended measuring mode
N - noncontact, semicontact
C - contact
cantilever series S - with calibrated SEM photo for each tip and guaranteed curvature

 

 

Copyright © 2003, Nano Technology Instruments - Europe BV.
Copyright © 1998-2003, NT-MDT. All rights reserved.
 
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No effect that requires more than 10 percent accuracy in measurement is worth investigating

Walther Nerns

 

PraMa Strumentazione Scientifica

Partita IVA n. 00668970148

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