CSG01/TiN Print E-mail
coated.jpgContact SPM probes CSG01 series with TiN conductive coating, resonant frequency 7-14kHz, force constant 0,01-0,08N/m.

csg01tina.jpg

CSG01/TiN/50

 

High Resolution CONTACT "GOLDEN" Silicon Cantilevers CSG01 series with TiN conductive coating

 

  • Standard chip size: 1.6x3.6x0.4 mm.
  • Compatible with the most commercial SPM devices.
  • High reflective Au coating (reflective property is 3 times better in comparison with uncoated cantilevers).
  • Tip side of the chip is coated by TiN conductive coating.
  • Thickness of TiN film is 20-30nm.
  • Typical curvature radius of a tip: 35 nm.
  • Tip height: 10 - 15 µm.
  • Each chip has one RECTANGULAR spring.
  • Recommended for contact modes.
  • Packaged in GelPak® boxes.

GelPak® is a registered trade mark of Vichem Corporation.

 

Specification for probes of CSG01 series

 

 

Chip thickness 0.4mm
Reflective side Au
Spring number 1
Aspect ratio 3:1
Cone angle f <=22°
Curvature radius of a tip typical 10nm
csg01ptb.jpg

 

 

Cantilever series

Spring

Cantilever lenght, L±5µm

Cantilever width, W±3µm

Cantilever thickness, µm

Resonant frequency, kHz

Force constant, N/m

min

typical

max

min

typical

max

min

typical

max

CSG01

B

350

35

0.7

1.0

1.3

7

10

14

0.01

0.03

0.08

 

 

Cantilever series

 

 

csg01ptc.jpg
Recommended measuring mode
N - noncontact, semicontact
C - contact
cantilever series S - with calibrated SEM photo for each tip and guaranteed curvature radius 10nm or less.

 

 

Copyright © 2003, Nano Technology Instruments - Europe BV.
Copyright © 1998-2003, NT-MDT. All rights reserved.
 
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